Surface Mount
Assembly

Through Hole
Assembly

High Reliability
Hand Soldering

Testing
Capabilities

Cable and
Wire Harness
Assembly

Value-Added
Services

Electronic
Component
Sales
 

1. Surface Mount Assembly
• MyData MY15
• MyData TP9s
• BGA capabilities
• Panel sizes up to 17" x 17"
• Vision alignment down to 0201
• Ability to place up to 31,000 components per hour with verification of passive and discrete components prior to placement
• ERSA BGA inspection system
• PACE rework station
  
  
  
2. Through Hole Assembly
• Axial insertion equipment
• Manual push line operations for low volume production
• Wave solder
• Axial and radial semi-automatic lead forming
  
  
  
3. High Reliability Hand Soldering
• Certified skilled hand soldering operators
• Capable of hand soldering 5 mil spaced leads
• Multiple solder alloys including high melting point (HMP, SN96, etc.)
  
  
  
4. Testing Capabilities
• HP and Teradyne In-Circuit Testing (ICT)
• System level functional testing
• Board level bench testing
• Elevated temperature testing
  
  
  
5. Cable and Wire Harness Assembly
• Automated wire cutting and stripping
• Semi-automated terminal crimping
  
  
  
6. Value-Added Services
• Box build - electromechanical assembly
• Conformal coating and potting
• Prototypes and quick turn services
• Engineering and design for manufacturing (DFM) support
• Modification services

Contact us for your next project.